Top 10 Lithography Equipment Manufacturers in 2025

Introduction

What’s the single most critical step that determines the precision and performance of a modern microchip? It's lithography. As semiconductor devices become smaller and more complex, lithography has become the heart of the integrated circuit (IC) fabrication process. This essential technology enables the transfer of intricate circuit patterns onto silicon wafers, defining the critical dimensions that power everything from smartphones to supercomputers.

Yet with increasing chip complexity, how do manufacturers keep up with the demand for ultra-high resolution and accuracy? That’s where advanced lithography equipment comes into play. These tools are not only responsible for enabling cutting-edge chip architectures but also for driving down costs and boosting productivity across semiconductor fabs worldwide.

In this article, you’ll discover the Top 10 Lithography Equipment Manufacturers in 2025. From EUV pioneers to packaging and e-beam specialists, these companies form the backbone of the chipmaking ecosystem. Each company plays a unique and vital role in the global supply chain.

1. ASML (Netherlands)

ASML is the undisputed global leader in photolithography equipment and a cornerstone of the modern semiconductor industry. Founded in 1984 and headquartered in Veldhoven, Netherlands, the company has played a pivotal role in enabling Moore’s Law for decades. ASML specializes in the development and manufacture of advanced photolithography systems used to produce integrated circuits with nanometer-scale precision.

The company’s flagship products include Extreme Ultraviolet (EUV) and Deep Ultraviolet (DUV) lithography systems. EUV, in particular, has revolutionized chip manufacturing by allowing the creation of ultra-fine patterns required for advanced nodes such as 5nm and below. ASML’s DUV platforms also remain crucial for high-volume production in mature and mainstream nodes.

ASML supplies its cutting-edge machines to every major semiconductor foundry, including TSMC, Samsung, and Intel. The company has been recognized for its continuous innovation, with milestones such as the first high-volume EUV shipment and consistent breakthroughs in light source technology, optics, and overlay accuracy.

ASML Company Information

2. Nikon Corporation (Japan)

Nikon Corporation, a globally recognized brand best known for its optical technologies, has been a prominent player in the semiconductor lithography field since the 1980s. Headquartered in Tokyo, Japan, Nikon entered the semiconductor equipment market to leverage its expertise in precision optics and imaging systems. Over the decades, the company has developed a broad portfolio of Deep Ultraviolet (DUV) lithography solutions that support i-line, KrF, and ArF exposure technologies.

Nikon's lithography equipment plays a crucial role in the production of both memory and logic chips, particularly for mature technology nodes. Its systems are well-regarded for high reliability, stable overlay performance, and long-term operational efficiency. These features make Nikon tools especially valuable in manufacturing environments where cost-effectiveness and yield stability are critical, such as in the production of legacy chips for automotive, industrial, and IoT applications.

The company is also known for strong after-sales support and long-term serviceability, making its solutions ideal for fabs seeking longevity and robust performance.

Nikon Corporation Information

3. Canon Inc. (Japan)

Canon Inc., a name synonymous with imaging and optical technology, also holds a strong position in the semiconductor manufacturing space through its Semiconductor Equipment Division. Headquartered in Tokyo and established in 1937, Canon began producing lithography equipment in the 1970s. Leveraging its precision optics heritage, the company has built a solid reputation for supplying high-performance photolithography systems tailored for specialized and mature-node applications.

Canon’s key offerings focus on i-line and KrF lithography technologies, with a product range designed specifically for power devices, MEMS (Micro-Electro-Mechanical Systems), display drivers, and other components built on mature process nodes. Unlike leading-edge EUV tools, Canon’s systems are engineered for cost-efficiency, smaller footprints, and ease of use, making them an ideal fit for manufacturers with limited cleanroom space or budget constraints.

Canon’s lithography solutions are valued for their durability, stable overlay performance, and compact system design, helping semiconductor fabs optimize throughput and efficiency in legacy and niche applications.

Canon Inc. Information

4. Shanghai Micro Electronics Equipment (SMEE, China)

Shanghai Micro Electronics Equipment Co., Ltd. (SMEE) stands as China’s leading domestic supplier of semiconductor lithography equipment. Founded in 2002 and headquartered in Shanghai, SMEE was established with the goal of localizing critical semiconductor manufacturing technologies. As China pursues technological self-reliance in the face of global supply chain challenges, SMEE plays a strategic role in supporting the country's ambitions for semiconductor independence.

SMEE specializes in DUV lithography systems, including KrF (248nm), ArF (193nm), and ArF immersion scanners, aimed at IC production from 90nm down to 28nm nodes. While still trailing behind EUV capabilities, SMEE's tools are vital for the domestic production of logic chips, display driver ICs, MEMS, and power management ICs. The company has made steady progress in local R&D, cleanroom manufacturing, and the integration of subsystems developed within China.

SMEE continues to drive localization efforts with an emphasis on developing core modules such as light sources, stages, and software domestically—paving the way for future self-sufficiency.

Shanghai Micro Electronics Equipment (SMEE) Information

5. Ultratech (USA, Part of Veeco Instruments)

Ultratech, now a part of Veeco Instruments Inc., has long been recognized as a pioneer in advanced packaging lithography and laser processing systems. Founded in the United States, Ultratech gained prominence for its advanced 1X steppers and laser spike annealing (LSA) systems. In 2017, the company was acquired by Veeco Instruments, enhancing Veeco’s capabilities in back-end semiconductor manufacturing.

Ultratech focuses primarily on back-end lithography for advanced packaging applications, including fan-out wafer-level packaging (FOWLP) and other heterogeneous integration processes. Its tools are known for enabling cost-effective scaling, fine overlay control, and superior depth of focus, which are crucial for 2.5D and 3D integration. As system scaling increasingly depends on innovations beyond traditional front-end node shrinking, Ultratech’s equipment plays a vital role in driving the future of system-in-package (SiP) technologies.

The company’s consistent investments in packaging lithography innovation have made it a preferred partner for semiconductor fabs and outsourced assembly and test (OSAT) providers worldwide.

Ultratech (Veeco Instruments) Information

6. SÜSS MicroTec (Germany)

SÜSS MicroTec is a respected name in the semiconductor equipment industry, with a specialized focus on mask aligners, projection lithography systems, and wafer bonding tools. Founded in Germany, the company has built a strong global reputation by supporting sub-200mm wafer processing and offering solutions tailored to MEMS, LED, compound semiconductor, and photonics applications. Its technologies are widely used in research institutes, foundries, and small to mid-scale production lines.

SÜSS MicroTec’s product range includes manual to fully automated mask aligners, projection lithography tools, maskless exposure systems, and advanced bond aligners. The company is also at the forefront of innovation in maskless lithography and substrate-level integration, making it ideal for flexible, specialty, and heterogeneous integration processes. Known for precision, reliability, and flexibility, SÜSS MicroTec is a go-to solution provider for applications where larger wafer sizes and advanced lithographic techniques are not required.

SÜSS MicroTec Company Information

7. EV Group (EVG, Austria)

EV Group (EVG) is a global technology leader in wafer bonding, lithography, and nanoimprint lithography (NIL) solutions. Headquartered in Austria, the company was founded in the early 1980s and has since established itself as a key player in advanced packaging, MEMS, photonics, and 3D integration technologies. EVG’s innovations support next-generation semiconductor manufacturing, particularly in applications that demand heterogeneous integration and ultra-precise structuring.

EVG’s product portfolio includes NIL systems, mask aligners, wafer bonders, and metrology tools, all designed for high-throughput and high-resolution processing. The company is best known for its pioneering role in Nanoimprint Lithography, a technique that enables sub-10 nm patterning and is seen as a viable path beyond conventional optical lithography. With a strong emphasis on R&D collaboration and customer support, EVG plays a strategic role in enabling 3D-ICs, optical interconnects, biosensors, and other high-growth fields.

EV Group Company Information

8. NuFlare Technology (Japan)

NuFlare Technology, a wholly owned subsidiary of Toshiba Corporation, is a specialist in electron beam (e-beam) lithography systems, particularly for photomask writing used in advanced semiconductor manufacturing. Founded in the early 2000s and headquartered in Yokohama, Japan, NuFlare has grown into one of the world’s top suppliers of mask writing tools, critical for fabricating masks at sub-10 nm and EUV (Extreme Ultraviolet) lithography levels.

The company's core product line includes EBM series mask writers, which offer high precision, fast writing speeds, and advanced resolution control, making them indispensable in high-end logic and memory chip production. NuFlare plays an essential role in the photomask supply chain, enabling the most advanced process nodes, including 5nm and below. Their systems are widely used by global foundries and integrated device manufacturers (IDMs), supporting both optical and EUV lithography mask production needs.

NuFlare Technology Company Information

9. JEOL Ltd. (Japan)

JEOL Ltd., headquartered in Tokyo, Japan, is a global leader in scientific and metrology equipment, particularly renowned for its innovations in electron beam (e-beam) lithography systems. Founded in 1949, JEOL has built a rich legacy in developing high-resolution tools for the research and academic community. Its e-beam lithography systems are widely used in nanotechnology R&D, semiconductor prototyping, and materials science—serving universities, national laboratories, and advanced research centers around the world.

JEOL’s direct-write e-beam systems are designed for precision patterning at the nanoscale, offering flexibility in processing a wide variety of materials and structures. The company emphasizes system stability, beam accuracy, and intuitive software interfaces to support complex pattern design. These systems are ideal for non-production environments, enabling cutting-edge exploration in nanofabrication, quantum devices, MEMS, and photonics. JEOL's deep roots in academic collaboration make it a cornerstone of advanced education and scientific development.

JEOL Ltd. Company Information

10. Vistec Electron Beam (Germany)

Vistec Electron Beam GmbH is a premier provider of high-precision electron beam (e-beam) direct-write lithography systems, known for their application in nanotechnology, semiconductor R&D, and maskless patterning. Based in Jena, Germany, and with a history that extends back to the 1980s through predecessor organizations, Vistec has carved out a specialized role in the fabrication of advanced nanoscale structures.

Vistec’s flagship product line includes the EBPG series, which offers direct-write lithography solutions for small-batch production, academic research, and development environments. These systems are renowned for their ultra-high resolution, beam stability, and sub-nanometer accuracy, making them ideal for prototyping advanced semiconductor devices, nanophotonic elements, and quantum components. The company collaborates closely with leading research institutions and national laboratories worldwide, positioning itself as a trusted partner in next-generation materials and device research.

Vistec Electron Beam Company Information

Conclusion

ASML remains unmatched in EUV lithography, enabling advanced nodes for top-tier fabs. Nikon and Canon continue to serve mature and mid-tier markets with DUV solutions, while SÜSS MicroTec and EV Group are at the forefront of MEMS, NIL, and 3D integration. JEOL, NuFlare, and Vistec bring critical e-beam capabilities to research and mask making, and companies like Ultratech and Veeco provide niche technologies supporting high-efficiency LED, advanced packaging, and compound semiconductor production.

This variety in lithography systems—EUV, DUV, NIL, and e-beam—ensures the ecosystem addresses the needs of logic, memory, specialty devices, and next-gen packaging alike.

Looking ahead, the lithography sector will see more convergence between resolution, overlay accuracy, and flexibility, particularly with growing demand for heterogeneous integration, AI chips, and photonics. As the global supply chain matures, collaborative innovation across these specialized companies will remain key to unlocking the next frontier of semiconductor performance.