Introduction
In semiconductor manufacturing, wafer probing – the process of establishing electrical contact to individual dies on a wafer – is a critical step that bridges fabrication with electrical test and yield analysis. The quality of wafer probe testing directly impacts functional validation, parametric characterization, and ultimately manufacturing yield.
The Electroglas EG2001 automatic wafer prober is a widely recognized system designed to perform high-precision, reliable wafer-level electrical testing. With a robust mechanical architecture and flexible configuration options, the EG2001 has been deployed in production, test labs, and research environments where stability and repeatability are fundamental.
This article provides a complete, engineering-oriented introduction to the Electroglas EG2001, covering its system architecture, technical capabilities, common applications, key accessories, and lifecycle support considerations.
What Is the Electroglas EG2001 Wafer Prober?
The Electroglas EG2001 is a fully automated wafer prober designed to perform electrical contact and test sequences on semiconductor wafers. It combines precision motion control with automated wafer handling to support accurate probing across hundreds or thousands of die on a wafer.
Key functions of the EG2001 include:
● Automated wafer loading and unloading
● Precision wafer alignment and positioning
● Probe-to-pad alignment and contact
● Integration with electrical testers
The system supports a variety of wafer sizes and can interface with parametric and functional test equipment to accommodate a broad range of test requirements.
System Architecture and Main Components
The success of a wafer probing platform lies in the coordination of several tightly integrated subsystems. The Electroglas EG2001 is built with modular components that work together to deliver repeatable and accurate test results.
1. Wafer Handling Subsystem
The wafer handling subsystem is responsible for:
● Loading wafers from cassettes or FOUPs
● Orienting wafers to a defined coordinate system
● Transferring wafers to the prober chuck
This subsystem minimizes particle generation and mechanical stress, contributing to better contact reliability and throughput.
2. Chuck and Temperature Control
The wafer chuck holds the wafer during probing and may include:
● Vacuum or electrostatic clamping
● Temperature control for consistent test conditions
Temperature stability on the chuck helps ensure consistent contact resistance and reduces measurement variability.
3. Precision Motion System
The EG2001 employs a precision X-Y motion stage and Z-axis control to position the wafer relative to the probes. Features include:
● High-resolution encoders for micron-level positioning
● Theta (rotational) alignment for die/pad orientation
● Z-axis control to regulate probe touchdown force
These motion components help minimize overlay error and reduce probe wear.
4. Optical Alignment System
Optical alignment is essential for accurate contact between the probe needles and wafer pads. The EG2001 uses:
● Microscope optics or camera-assisted alignment
● Pattern recognition software
● Die edge and fiducial alignment strategies
Accurate optical alignment reduces setup time and improves contact reliability.
5. Control Electronics and Software
The prober’s control system manages:
● Motion control and recipe execution
● Test site coordination
● Communication with external test systems
● User interface and logging
Modern versions of the EG2001 software support recipe storage and repeatable test configuration.
Technical Capabilities and Specifications
The Electroglas EG2001 is designed to balance flexibility, precision, and operational stability. While exact specifications can vary by configuration and installed options, typical characteristics include:
| System Attribute | Typical Capability |
|---|---|
| Wafer Size Support | 100 mm, 150 mm, 200 mm (config dependent) |
| Alignment Accuracy | Micron-level optical and stage alignment |
| Probing Modes | Manual, semi-automatic, automatic |
| Temperature Control | Optional chuck temperature control |
| Integration | Compatible with parametric and functional testers |
The EG2001 emphasizes positioning repeatability and contact stability over raw throughput, making it suitable for both production and engineering use.
Typical Applications of the EG2001
The Electroglas EG2001 supports a broad range of semiconductor test applications:
Semiconductor Wafer Sort
● Contacting and testing die before packaging
● Yield monitoring and binning
● Early defect detection
Parametric Characterization
● Process monitoring
● Device electrical characterization
● Manufacturing process control
R&D and Engineering Validation
● Prototype wafer test
● Probe card evaluation
● New device development and debugging
Mature Node Production
For mature technology nodes where high resolution patterning is less critical, the EG2001 remains a reliable choice due to its stable contact mechanics and proven motion control.
Accessories and Spare Parts for the EG2001
Long-term operation of an EG2001 system depends on timely replacement of wear items and access to compatible accessories. Key parts include:
Mechanical Components
● X-Y-Z motion stage modules
● Bearings, guide rails, and belts
● Wafer handling arms
Chuck and Vacuum Components
● Chuck plates and vacuum foot pads
● Seals, gaskets, and vacuum tubing
● Temperature control hardware
Optical and Alignment Hardware
● Microscope optics
● Alignment cameras
● Illumination modules
Electronics and Controllers
● Motion control boards
● I/O interface cards
● Power supplies and cooling modules
Consumables
● Filters
● Connectors and cables
● Wear-parts for automated handlers
Ensuring parts conform to original system tolerances is essential for maintaining mechanical precision and repeatability.
System Integration and Test Equipment Interfaces
The EG2001 can be integrated with external test and factory automation systems to create efficient test platforms:
● Parametric testers for electrical measurements
● Functional testers for logic and memory device testing
● Metrology equipment for alignment and calibration
● Factory automation interfaces for wafer flow management
Seamless integration improves factory throughput and reduces manual handling risk.
Lifecycle Support and Maintenance Considerations
Operators of legacy or long-serving EG2001 systems should plan for:
● Preventive maintenance scheduling
● Strategic spare parts inventory
● Stage calibration and optical alignment tuning
● Refurbishment of motion and control modules
Addressing these needs proactively helps minimize unplanned downtime and extends usable system life.
Conclusion
The Electroglas EG2001 wafer prober remains a proven and versatile platform for wafer-level electrical testing across a wide range of semiconductor workflows. Its modular architecture, precision motion control, and flexible integration options make it suitable for both production and engineering environments.
Understanding the system’s architecture, capabilities, and accessory needs helps engineers and operations teams optimize performance and plan long-term support.
As a professional supplier specializing in Electroglas EG2001 systems and compatible accessories, we focus on delivering technically verified equipment, quality spare parts, and practical support knowledge — enabling customers to maintain stable wafer test operations and maximize the value of their test infrastructure over the long term.
